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IEC 60749-20-1-2009 PDF FORMAT


The files are in electronic format(PDF/DOC/DOCX) and will be sent to your email in hours.
Standard Title:
English -- Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat - Edition 1.0
French -- Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 20-1: Manipulation, emballage, étiquetage et transport des composants pour montage en surface sensibles à l'effet combiné de l'humidité et de la chaleur de brasage - Edition 1.0
Standard NO.:IEC 60749-20-1-2009

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This product was added to our catalog on Thursday 15 October, 2015.